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 HFA50PA60CPbF
Vishay High Power Products
HEXFRED(R) Ultrafast Soft Recovery Diode, 2 x 25 A
FEATURES
* * * * * * * Ultrafast recovery Ultrasoft recovery Very low IRRM Very low Qrr Specified at operating conditions Lead (Pb)-free Designed and qualified for industrial level
Pb-free Available
Base common cathode 2
RoHS*
COMPLIANT
BENEFITS
TO-247AC
1 3 Anode Anode 2 1 2 Common cathode
* * * * *
Reduced RFI and EMI Reduced power loss in diode and switching transistor Higher frequency operation Reduced snubbing Reduced parts count
DESCRIPTION
HFA50PA60C is a state of the art center tap ultrafast recovery diode. Employing the latest in epitaxial construction and advanced processing techniques it features a superb combination of characteristics which result in performance which is unsurpassed by any rectifier previously available. With basic ratings of 600 V and 25 A per leg continuous current, the HFA50PA60C is especially well suited for use as the companion diode for IGBTs and MOSFETs. In addition to ultrafast recovery time, the HEXFRED(R) product line features extremely low values of peak recovery current (IRRM) and does not exhibit any tendency to "snap-off" during the tb portion of recovery. The HEXFRED features combine to offer designers a rectifier with lower noise and significantly lower switching losses in both the diode and the switching transistor. These HEXFRED advantages can help to significantly reduce snubbing, component count and heatsink sizes. The HEXFRED HFA50PA60C is ideally suited for applications in power supplies and power conversion systems (such as inverters), motor drives, and many other similar applications where high speed, high efficiency is needed.
PRODUCT SUMMARY
VR VF at 25 A at 25 C IF(AV) trr (typical) TJ (maximum) Qrr (typical) dI(rec)M/dt (typical) at 125 C IRRM (typical) 600 V 1.7 V 2 x 25 A 23 ns 150 C 112 nC 160 A/s 4.5 A
ABSOLUTE MAXIMUM RATINGS
PARAMETER Cathode to anode voltage Maximum continuous forward current Single pulse forward current Maximum repetitive forward current Maximum power dissipation Operating junction and storage temperature range per leg per device SYMBOL VR IF IFSM IFRM PD TJ, TStg TC = 25 C TC = 100 C TC = 100 C TEST CONDITIONS VALUES 600 25 50 225 100 150 60 - 55 to + 150 W C A UNITS V
* Pb containing terminations are not RoHS compliant, exemptions may apply Document Number: 94074 Revision: 25-Jul-08 For technical questions, contact: diodes-tech@vishay.com www.vishay.com 1
HFA50PA60CPbF
Vishay High Power Products
HEXFRED(R) Ultrafast Soft Recovery Diode, 2 x 25 A
ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 C unless otherwise specified)
PARAMETER Cathode to anode breakdown voltage SYMBOL VBR IR = 100 A IF = 25 A Maximum forward voltage VFM IF = 50 A IF = 25 A, TJ = 125 C Maximum reverse leakage current Junction capacitance Series inductance IRM CT LS VR = VR rated TJ = 125 C, VR = 0.8 x VR rated VR = 200 V See fig. 2 See fig. 3 See fig. 1 TEST CONDITIONS MIN. 600 TYP. 1.3 1.5 1.3 1.5 600 55 12 MAX. 1.7 2.0 1.7 20 2000 100 A pF nH V UNITS
Measured lead to lead 5 mm from package body
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 C unless otherwise specified)
PARAMETER Reverse recovery time See fig. 5, 10 Peak recovery current See fig. 6 Reverse recovery charge See fig. 7 Peak rate of fall of recovery current during tb See fig. 8 SYMBOL trr trr1 trr2 IRRM1 IRRM2 Qrr1 Qrr2 dI(rec)M/dt1 dI(rec)M/dt2 TEST CONDITIONS IF = 1.0 A, dIF/dt = 200 A/s, VR = 30 V TJ = 25 C TJ = 125 C TJ = 25 C TJ = 125 C TJ = 25 C TJ = 125 C TJ = 25 C TJ = 125 C IF = 25 A dIF/dt = 200 A/s VR = 200 V MIN. TYP. 23 50 105 4.5 8.0 112 420 250 160 MAX. 75 160 10 15 375 1200 A/s A ns UNITS
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER Lead temperature Junction to case, single leg conducting Junction to case, both legs conducting Thermal resistance, junction to ambient Thermal resistance, case to heatsink Weight Mounting torque Marking device Case style TO-247AC SYMBOL Tlead TEST CONDITIONS 0.063" from case (1.6 mm) for 10 s MIN. RthJC RthJA RthCS Typical socket mount Mounting surface, flat, smooth and greased 6.0 (5.0) 0.25 6.0 0.21 0.42 K/W 40 12 (10) g oz. kgf * cm (lbf * in) TYP. MAX. 300 0.83 UNITS C
HFA50PA60C
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For technical questions, contact: diodes-tech@vishay.com
Document Number: 94074 Revision: 25-Jul-08
HFA50PA60CPbF
HEXFRED(R) Vishay High Power Products Ultrafast Soft Recovery Diode, 2 x 25 A
10000 1000
T = 150C J
100
100 10 1 0.1
TJ = 125C
TJ = 25C
TJ = 150C T = 125C
J J
0.01 0 200 400 600
Reverse Voltage - V R (V)
Fig. 2 - Typical Reverse Current vs. Reverse Voltage (Per Leg)
T = 25C
10
1000
A
T = 25C J
100 1 0.6
1.0
1.4
1.8
2.2
2.6
Forward Voltage Drop - V FM (V)
10 1 10 100 1000
Reverse Voltage - V R (V)
Fig. 1 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current (Per Leg) Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage (Per Leg)
1
Thermal Response (Z thJC )
D = 0.50
0.20 0.10 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x Z thJC + TC 0.001 0.01 0.1 1 PDM t1 t2
0.1
0.01 0.00001
0.0001
t1 , Rectangular Pulse Duration (sec)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics (Per Leg)
Document Number: 94074 Revision: 25-Jul-08
For technical questions, contact: diodes-tech@vishay.com
www.vishay.com 3
HFA50PA60CPbF
Vishay High Power Products
HEXFRED(R) Ultrafast Soft Recovery Diode, 2 x 25 A
1400
140
I F = 50A
120
I F = 25A I F = 10A
1200
VR = 200V TJ = 125C TJ = 25C
I F = 50A
100 1000
I F = 25A I F = 10A
800
80
60
600
40
400
20
VR = 200V TJ = 125C TJ = 25C
200
0 100
di f /dt - (A/s)
1000
0 100
di f /dt - (A/s)
1000
Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt (Per Leg)
Fig. 7 - Typical Stored Charge vs. dIF/dt (Per Leg)
30 VR = 200V TJ = 125C TJ = 25C 25
10000 VR = 200V TJ = 125C TJ = 25C
I F = 50A I F = 25A
20
I F = 50A I F = 25A I F = 10A
I F = 10A
15
1000
10
5
0 100
di f /dt - (A/s)
1000
100 100
1000
di f /dt - (A/s)
Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt (Per Leg)
Fig. 6 - Typical Recovery Current vs. dIF/dt (Per Leg)
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For technical questions, contact: diodes-tech@vishay.com
Document Number: 94074 Revision: 25-Jul-08
HFA50PA60CPbF
HEXFRED(R) Vishay High Power Products Ultrafast Soft Recovery Diode, 2 x 25 A
VR = 200 V
0.01 L = 70 H D.U.T.
dIF/dt adjust
D G IRFP250 S
Fig. 9 - Reverse Recovery Parameter Test Circuit
(3)
IF
0
trr ta tb
Qrr
(2)
(4)
IRRM
0.5 IRRM dI(rec)M/dt (5) 0.75 IRRM
(1) dIF/dt (1) dIF/dt - rate of change of current through zero crossing (2) IRRM - peak reverse recovery current (3) trr - reverse recovery time measured from zero crossing point of negative going IF to point where a line passing through 0.75 IRRM and 0.50 IRRM extrapolated to zero current. (4) Qrr - area under curve defined by trr and IRRM Qrr = trr x IRRM 2
(5) dI(rec)M/dt - peak rate of change of current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
Document Number: 94074 Revision: 25-Jul-08
For technical questions, contact: diodes-tech@vishay.com
www.vishay.com 5
HFA50PA60CPbF
Vishay High Power Products
HEXFRED(R) Ultrafast Soft Recovery Diode, 2 x 25 A
ORDERING INFORMATION TABLE
Device code
HF
1 1 2 -
A
2
50
3
PA
4
60
5
C
6
PbF
7
HEXFRED(R) family Process designator: A = Subs. electron irradiated B = Subs. platinum Current rating (50 = 50 A) Package outline (PA = TO-247, 3 pins) Voltage rating (60 = 600 V) Configuration (C = Center tap common cathode) None = Standard production PbF = Lead (Pb)-free
3 4 5
6 7
LINKS TO RELATED DOCUMENTS Dimensions Part marking information http://www.vishay.com/doc?95223 http://www.vishay.com/doc?95226
www.vishay.com 6
For technical questions, contact: diodes-tech@vishay.com
Document Number: 94074 Revision: 25-Jul-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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